Click here to learn more about these products.
MG Chemicals - 8329TFF-25ML 8329TFF Thermally Conductive Adhesive - Fast Cure Epoxy, 25 mL Dual Dispenser
Thermal conductivity of 0. 8 WmK. 11 mix ratio. Working life 4 minutes, set time 15 minutes. Cure time 3 hours at room temperature or 15 minutes at 65 c 149 f. Flame retardant UL 94V-0 registered.
MG Chemicals 8329TCS Thermal Conductive Adhesive, Slow Cure, 15 g, 2 Dispeners, 8329TCS-6ML, 6 mL Kit,Dark Grey
Good low temperature alternative to 1-part TC adhesives with inconveniently high cure temperature. Excellent 1. 44 Wmake thermal conductivity. 1-to-1 mix ratio and 4 hours pot life. Stores and ships at slightly below room temperature no freezing or dry ice required. Very long shelf life of at least three years even when stored at room temperature. Strong water and chemical resistance to brine, acids, bases, and aliphatic hydrocarbons.
GENNEL G109 10gram Thermal Conductive Glue, Silicone Glue, Thermal Plaster, Silicone Viscous Adhesive Compound, Heatsink Glue for LED GPU MOSFET Printer Chipset IC High Performance
Non-Electrical Conductive,Non-corrosive ,Non-toxic,Suitable for all heatsink without fixed clip. It has heat conducting properties, strong adhesion. Helps disperse the heat from Chipset to heatsink effectively.. Use for MOSFET, LED, heat sinks , North-south bridge, video card, Chipset, heat dissipation part, heat dissipation, electrical appliances, instruments and other industries.. It has good thermal conductivity and wide service temperature range-60250 degrees Celsius. Thermal conductivity 1.5Wm-K, Do not use thermal glue between CPU and HEATSINK. Package Includes 1 x GENNEL G109 10g thermal glue.
Halnziye 10Gram Thermal Conductive Glue Silicone Plaster Viscous Adhesive Cooling Compound for LED GPU Chipset Heatsink
Do Not Use Thermal Glue Between CPU Chip And Heat Sink, use it within 24 hours once opened.. Thermal conductivity 1.2Wm-K. Strength of connected buildings 55 lb.. Features thermal properties, strong adhesion. Application apply to all heatsink no fixed clip thermal paste. Ideal for MOSFET Heatsink VGA CARD Northbridge Southbridge Heatsink..
Easycargo 10gram Thermal Conductive Glue Kit, High Performance Silicone Thermal Plaster Adhesive Glue, Cooler Epoxy Compound for Heatsink GPU VRM VRAM LED IC Chips MOSFET BJT Transistor 3D Printer PCB
10 gram high performance thermal glue with strong adhesion.. Thermal conductivity 0.975 wmk. Thermal Impedance 0.06. Non-Electrical Conductive. Premium thermal conductive glue for bonding the interface of cooler heatsink and GPU VRM VRAM PCB LED, BJT MOSFET transistor, Voltage regulator, IC Chips, etc.
MAX EPC Epoxy Potting Compound 4 Circuit Boards -Slow Curing & Low Exothermic 4 Large Casting, High Thermal Conductivity, Seal, Mask, Waterproof & Insulate Electrical Circuits, Read Description Below
Epoxy Potting Compound, Thermally Conductive For Fast Heat Dissipation. Large Mass, Thick Cross-Section, Low Exothermic Heat Generation. Lower Viscosity Compared To Other Thermally Conductive Potting Compound. Insulates ACDC Current, Suitable For High And Low Voltage Insulating. Long Working Time - Cures In 24 Hours 25C- Heat Curable For Faster Processing.
MG Chemicals 8329TFS Thermally Conductive Adhesive - Slow Cure, 25mL Dual Dispenser
Thermal conductivity 1. 22 WM K. Working life of 4 hours. Cure time of 1 hour 20 minutes at 80 C or 96 hours at room temperature. Dual Dispensing Unit. Dispensing Gun sold separately cat 8DG-50-1-1.
MG Chemicals - 8329TFF-50ML 8329TFF Thermally Conductive Adhesive - Fast Cure Epoxy, 45 mL Dual Cartridge
Thermal conductivity of 0. 8 WmK. 11 mix ratio. Working life 4 minutes, set time 15 minutes. Cure time 3 hours at room temperature or 15 minutes at 65 c 149 f. Flame retardant UL 94V-0 registered.
MG Chemicals 832TC-450ML Thermally Conductive Epoxy Encapsulating and Potting Compound, 15 oz Kit, Black
Excellent electrical and thermal conductivity. Easy 11 mix ratio. Strong water and chemical resistance to brine, acids, bases, and aliphatic hydrocarbons. Suitable for large production runs. Excellent machining properties.
MG Chemicals 8330S Silver Epoxy Adhesive, Extreme Conductivity, 4 hr. Working time, 21 g, 2 Dispeners (8330S-21G)
Excellent 0.0007 cm electrical resistivity and 2.4 WmK thermal conductivity. Easy 11 mix ratio and long working time may be mixed once and then used as a 1-part epoxy for a four hour production shift. Heat Cure is Required. Cure temperature of only 65 C for 2 hours lower than most 1-part epoxies and suitable for use on heat sensitive components.. Very long shelf life of at least two years even when stored at room temperature. Strong water and chemical resistance to brine, acids, bases, and aliphatic hydrocarbons.
Best Choice
Best Value
